lunes, 19 de marzo de 2018

Additive Manufacturing for RF Components


The Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) Weapons Development and Integration (WDI) Directorate has a program known as PRIntable Materials with Embedded Electronics (PRIME2). PRIME2 will integrate RF and electronics into Additive Manufacturing processes to reduce size, weight, and overall cost of these components and subsystems.

This program will advance the state of the art in printable electronics, and deliver a materials database, process development, modeling, and simulation of 3D-printed objects with embedded conductive elements, passive prototypes, and RF prototypes. PRIME2 will create a new fabrication capability (applied to electronics and RF technology areas), weight reduction, higher reliability, and on-demand (local and immediate) spare components in the field.